SURFACE ACOUSTIC WAVE DEVICE HAVING SAW CHIP ATTACHED TO FIRST SUBSTRATE FOR SEALING UP SECOND SUBSTRATE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A surface acoustic wave device having a SAW chip attached to a first substrate for sealing up a second substrate and a fabricating method thereof are provided to enhance a sealing characteristic by increasing a joining surface area between the first and the second substrates. CONSTITUTION: A duplexer is composed of the transmit filter(10a), the receive filter(10b), and a matching circuit(4). A surface acoustic wave device includes a first substrate, a second substrate, a surface acoustic wave chip and a second substrate. The surface acoustic wave chip is attached to the first substrate. The second substrate is used for hermetically sealing the surface acoustic wave chip. One or more of the first and second substrates includes silicon. The first and second substrates have joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.