| 摘要 |
PROBLEM TO BE SOLVED: To restrict an etching on the bottom of a semiconductor wafer when manufacturing a semiconductor device. SOLUTION: When manufacturing the semiconductor device, another main surface (5) of a semiconductor wafer (1) is opposed to one main surface (6) of a reinforcing plate (2) at a specific space, and the reinforcing plate (2) and the semiconductor wafer (1) are sequentially overlapped on a hot plate (9) and come into contact with adhesives (7, 8). The reinforcing plate (2) and the semiconductor wafer (1) are held on the hot plate (9), while a pair of adhesives (7, 8) are heated, so that the adhesives (7, 8) are fused to an integrated adhesive layer (13). The viscosity of the adhesives (7, 8) is naturally lowered by heating to form an adhesive layer (13). Therefore, there scarcely exist any bubbles which are involved into the inside in the adhesive layer (13) from an interface of the pair of adhesives (7, 8). Thereafter, one main surface (4) provided with a plurality of etching masks (3) is exposed to dip the semiconductor wafer (1) in an etchant, and the semiconductor wafer (1) is divided into a plurality of semiconductor devices (14). COPYRIGHT: (C)2005,JPO&NCIPI |
