| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of preventing the outflow of an interlayer adhesive agent while maintaining other characteristics, as a manufacturing method of a multilayer flexible printed wiring board. SOLUTION: In the manufacturing process of a multilayer flexible printed wiring board, a plurality of printed circuit substrates and flexible circuit substrates are superposed through an interlayer bonding sheet and formed through laminate molding by heating and pressure bonding. A mold releasing multilayer film has a mold releasing layer film contacting with the interlayer film of a thermoplastic resin having a softening point lower than the melting starting temperature of the interlayer bonding sheet and a matter to be formed by laminate molding, and has a melting point higher than a heating and pressurizing temperature. The multilayer film is mounted on the mold releasing multilayer film at a position contacting with the matter between a patch and the matter, then, the wiring board is formed through heating and pressurizing. COPYRIGHT: (C)2005,JPO&NCIPI |
