| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat conduction structure of electronic equipment in which generated heat from electrical parts can be conducted to a substrate frame or a cover member while the breakdown of the electrical parts and the breakdown of a heat conduction system by vibrations can be prevented, and which has excellent heat-conduction performance and vibration-resistant performance. SOLUTION: The heat conduction structure of the electronic equipment has the substrate frame 1 in which a substrate 2 with the electrical part 3 mounted thereon is housed and which is sealed hermetically by the cover member 4 and prevents an external effect on the substrate 2, and a heat conduction member conducting the heat generation of the part 3 to the frame 1 or the member 2. The heat conduction structure has a first heat conduction plate 6 mounted on the part 3 through a silicon material 5, a vibration absorption member 7 composed of a heat-conductive flexible member connected to the plate 6, and a second heat conduction plate 8 connected to the member 7 and connected to the frame 1 or the member 4. COPYRIGHT: (C)2005,JPO&NCIPI
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