发明名称 MEMBER FOR HEAT DISSIPATION AND CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a member for a heat dissipation which has excellent handling properties at a normal temperature, is interposed between a heating element and a heat sinking body, can conduct a heat generated from the heating element efficiently by a close adhesion on the heating element and the heat sinking body by a high flexibility to the heat sinking body, and can keep the closely attached state even when a temperature is increased; and to provide a connecting structure in which the heating element and the heat sinking body are connected by the member for the heat dissipation. SOLUTION: In the member for the heat dissipation containing a thermoplastic resin and thermal conductive minute particles and being composed of a thermoplastic resin composition containing no compound having the melting temperature at 40 to 80°C, a storage elastic modulus in the case of 0.1 Hz at 23°C is 50,000 Pa or more, a fixed form is held, the storage elastic modulus in the case of 0.1 Hz at 50 to 80°C is 400 to 10,000 Pa, the storage elastic modulus in the case of 0.1 Hz at 100°C is 5,000 Pa or less and an amorphous shape is formed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004288825(A) 申请公布日期 2004.10.14
申请号 JP20030078203 申请日期 2003.03.20
申请人 SEKISUI CHEM CO LTD 发明人 AZUMA KENICHI;HASEGAWA ATSUSHI;HYOZU SHUNJI
分类号 C08K3/00;C08L23/22;C08L33/08;C08L53/02;C08L101/00;H01L23/36;H01L23/373;H05K7/20;(IPC1-7):H05K7/20 主分类号 C08K3/00
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