| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin material used as an electrode connection part which suppresses short-circuiting caused by adhesion of water between electrodes. SOLUTION: The resin material 5 for suppressing short-circuiting comprises a resin 52, and a short-circuiting suppression material 51 containing a sugar 511 including at least either one of sucrose, glucose or fractose. In a circuit board 4 formed from the short-circuiting suppression resin material 5, if water drop 7 is adhered between an electrode 61 and an electrode 62, the sugar 511 contained in the short-circuiting inhibitor 51 at the surface of a circuit board 4 dissolves into the water drop 7 and thus suppresses short-circuiting between the electrode 61 and the electrode 62. COPYRIGHT: (C)2005,JPO&NCIPI
|
