| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of prior art that a large quantity of reaction products having firm chemical bonding strength adhere to a substrate to be treated when dry-etching a refractory metal. SOLUTION: After effecting desired etching using a process gas in a dry etching treatment, the process gas is replaced with a non-process gas while maintaining electric discharge, so that the reaction products are discharged in the gaseous state. Thus, the reaction products are prevented from adhering to the substrate to be treated. COPYRIGHT: (C)2005,JPO&NCIPI
|
