| 摘要 |
PURPOSE: A semiconductor device is provided to reduce stress due to a guard contact and to prevent damage of chips by using an improved guard ring structure. CONSTITUTION: A semiconductor device includes a semiconductor chip(30), a thin film on the semiconductor chip, a guard ring(32) of metal material, and a guard contact(34) with a desired width. The guard ring is formed on rim portions of the semiconductor chip. The guard contact is arranged to a multiple loop shape for connecting the guard ring to a semiconductor substrate through the thin film.
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