| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having excellent adhesion of an inter-layer insulating layer and a wiring layer and having high reliability and a manufacturing method for the wiring board. SOLUTION: The wiring board contains a base material 10, the first wiring layer 200 in which a plurality of first wirings 20 are arrayed to the upper section of the base material by a specified pattern, the inter-layer insulating layer 30 formed so as to coat the wiring layer 200 and composed of a urethane resin, and the second wiring layer 500 in which a plurality of second wirings 50 are arrayed to the upper section of the inter-layer insulating layer 30 by the specified pattern. COPYRIGHT: (C)2005,JPO&NCIPI |
