发明名称 |
MANUFACTURING METHOD OF CHAMBER, BOARD PROCESSING UNIT AND SEMICONDUCTOR UNIT USING THIS |
摘要 |
PROBLEM TO BE SOLVED: To obtain the structure of the vacuum chamber that can vacuum seal easily by a plate-like material and a seal material solving the problems for the waste of material in the machined method by the machine processing from a block, the heat distortion removal work by the weld heating and the high cost as the finish processing is required. SOLUTION: Four pieces or more side face materials 1 to 4 that are composed of a hollow frame body 11 closed toward the circumference joining an end face mutually and an upper face member 5, and a lower face member 6 that are arranged and jointed on the upper face and the lower face of this hollow frame body 11 are made to an integral airtight vacuum chamber structure by providing a seal member 7 between mutual adjoining joint faces of the respective member. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004286165(A) |
申请公布日期 |
2004.10.14 |
申请号 |
JP20030081020 |
申请日期 |
2003.03.24 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
MATSUDA SATOYUKI;NIIMURA NORIHIRO;SEKIYAMA HIROSHI;AKUTSU NORIO |
分类号 |
B65D6/28;B01J3/03;B65D81/20;F16J12/00;F16J15/10;(IPC1-7):F16J12/00 |
主分类号 |
B65D6/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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