A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
申请公布号
WO2004087563(A2)
申请公布日期
2004.10.14
申请号
WO2004US09231
申请日期
2004.03.24
申请人
REFLECTIVITY, INC.;PATEL, SATYADEV, R.;DOAN, JONATHAN