| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board equipped with a conductor post which is provided with a smooth surface and kept free from defects, such as voids or the like, inside. SOLUTION: The wiring board is equipped with an insulating layer, a via hole penetrating through the insulating layer, and a metal layer exposed on the bottom of the via hole. The via hole bored in the wiring board is filled up with metal by electrolytic copper plating to form the conductor post on the metal layer exposed on the bottom of the via hole in the method of manufacturing the wiring board. The surface of the metal layer exposed on the bottom of the via hole has a roughness of 0.5μm or below. The conductor post is formed by filling the viahole with electrolytic copper plating as thick as 5 to 25μm in the thickness direction of the insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI
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