| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition which is a thermosetting resin composition comprising a polyimide resin and an epoxy resin and affording a cured product having excellent heat resistance, a low permittivity and dielectric dissipation factor and good mechanical properties such as tensile strength and tensile elongation and a small coefficient of linear expansion and to provide a method for producing the polyimide resin composition used in the thermosetting resin composition. SOLUTION: The thermosetting polyimide resin composition comprises a polyimide resin (X) having carboxy groups, an epoxy resin (Y) and a petroleum resin (Z). The method for producing the polyimide resin composition comprises reacting a polyisocyanate compound (A) with an acid anhydride (B) obtained from a polycarboxylic acid having≥3 carboxy groups in the presence of the petroleum resin (Z). Furthermore, the method for producing the polyimide resin composition comprising reacting the acid anhydride (B1) having the carboxy groups with a cyclopentadiene resin (Z1) and then reacting the resultant product with the polyisocyanate compound (A) is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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