发明名称 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
摘要 A printed wiring board (100) having an embedded electric device (41) is manufactured as follows. A first resin film (23) having an opening (35) or a sheet member (81) having a recess (82) is piled with a plurality of second resin films (23), on which a plurality of conductive layers (22) are formed. The first and second resin films (23) and the sheet member (81) include thermoplastic resin. An electric device (41) is inserted in the opening (35) or the recess. Then, the piled body including the electric device (41) is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes (42) of the electric device (41) are electrically connected to the conductive layers (22) while the first and second resin films (23) and the sheet member (81) plastically deformed to seal the electric device (41). <IMAGE> <IMAGE> <IMAGE>
申请公布号 EP1267597(A3) 申请公布日期 2004.10.13
申请号 EP20020013103 申请日期 2002.06.13
申请人 DENSO CORPORATION 发明人 KONDO, KOJI;YOKOCHI, TOMOHIRO;MIYAKE, TOSHIHIRO;TAKEUCHI, SATOSHI
分类号 H05K1/05;H05K1/18;H05K3/40;H05K3/46 主分类号 H05K1/05
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