| 发明名称 |
SEMICONDUCTOR DEVICE WITH CO-PACKAGED DIE |
| 摘要 |
A co-package semiconductor device including an outer clip in the form of a metal can includes also two semiconductor dies, at least one of which uses the outer clip as an electrical connector. An inner clip is used to dispose one of the dies within the outer clip. The inner clip may be insulated from the outer clip by an insulating layer. |
| 申请公布号 |
EP1466363(A1) |
申请公布日期 |
2004.10.13 |
| 申请号 |
EP20020773747 |
申请日期 |
2002.10.09 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING, MARTIN |
| 分类号 |
H01L23/10;H01L25/18;H01L23/02;H01L23/047;H01L23/12;H01L23/28;H01L23/34;H01L23/48;H01L23/492;H01L23/495;H01L25/04;H01L25/07;H01L25/11;H01L25/16;H01L29/74;H05K5/06;H05K7/20 |
主分类号 |
H01L23/10 |
| 代理机构 |
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代理人 |
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