发明名称 |
Method for growing ultra thin nitrided oxide |
摘要 |
A method of nitriding a gate oxide layer by annealing a preformed oxide layer with nitric oxide (NO) gas is disclosed. The nitridation process can be carried out at lower temperatures and pressures than a conventional nitrous oxide anneal while still achieving acceptable levels of nitridation. The nitridation process can be conducted at atmospheric or sub-atmospheric pressures. As a result, the nitridation process can be used to form nitrided gate oxide layers in-situ in a CVD furnace. The nitrided gate oxide layer can optionally be reoxidized in a second oxidation step after the nitridation step. A gate electrode layer (e.g., boron doped polysilicon) can then be deposited on top of the nitrided gate oxide layer or on top of the reoxidized and nitrided gate oxide layer.
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申请公布号 |
US6803330(B2) |
申请公布日期 |
2004.10.12 |
申请号 |
US20010975256 |
申请日期 |
2001.10.12 |
申请人 |
CYPRESS SEMICONDUCTOR CORPORATION |
发明人 |
RAMKUMAR KRISHNASWAMY;NARAYANAN SUNDAR |
分类号 |
H01L21/28;H01L29/51;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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地址 |
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