发明名称 PROCESS GAS SUPPLY DEVICE AND PROCESS GAS SUPPLY SYSTEM OF SEMICONDUCTOR FABRICATION EQUIPMENT USING RF POWER AND METHOD FOR THE SAME
摘要 PURPOSE: A process gas supply device and a process gas supply system of semiconductor fabrication equipment using RF power and a method for the same are provided to improve the uniformity by increasing the supply amount of process gas to an outside of a wafer in comparison to a center of the wafer. CONSTITUTION: A process gas supply device is used for supplying a process gas from plural nozzles(32) installed at an upper part of a chamber to a wafer. The supply amount of the process gas provided to an outside of a wafer is larger than the supply amount of the process gas provided to a center of the wafer by controlling each aligning state of the nozzles. The density of the nozzles directed to the outside of the wafer is higher than the density of the nozzles directed to the center of the wafer.
申请公布号 KR20040085244(A) 申请公布日期 2004.10.08
申请号 KR20030019877 申请日期 2003.03.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SEONG SEOK;PARK, JIN JUN
分类号 C23C16/00;C23C16/44;C23C16/455;C23C16/509;H01L21/02;(IPC1-7):H01L21/02 主分类号 C23C16/00
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