发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF PROCESSING SEMICONDUCTOR SUBSTRATE FOR IMPROVING OPTICAL PROPERTIES |
摘要 |
PURPOSE: A semiconductor device and a method of processing a semiconductor substrate are provided to minimize the amount of light interrupted due to the substrate by securing the angle between a side of a concavity and a second main surface of the substrate as much as 90 degrees or more. CONSTITUTION: A semiconductor substrate(1) has a first main surface(3b) and a second main surface(3a). A device forming layer(2) is formed on the first main surface of the substrate. A concavity(4) is formed at the second main surface of the substrate. A convexity(5) is formed at a bottom of the concavity, wherein the convexity is functioned as a solid immersion lens. The angle between a side(4b) of the concavity and the second main surface is larger than 90 degrees.
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申请公布号 |
KR20040086036(A) |
申请公布日期 |
2004.10.08 |
申请号 |
KR20030026924 |
申请日期 |
2003.04.29 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KOYAMA TOHRU;YOSHIDA TAKESHI |
分类号 |
B23B5/36;G01N21/66;H01L21/66;H01L29/06;(IPC1-7):H01L21/66 |
主分类号 |
B23B5/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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