| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of unevenness in processing such as etching and developing, on the surface of a substrate. SOLUTION: The substrate 1 to the surface of which etching liquid, a developer, or the like, is applied is washed while the substrate is moved in a substrate moving direction by means of rollers 2a in a washing tank. A plurality of nozzles 4a are downwardly attached to a nozzle header 3a diagonally in the substrate moving direction. On the other hand, a plurality of nozzles 4b are downwardly attached to a nozzle header 3b diagonally in the direction opposite to the substrate moving direction. The respective nozzles 4b of the nozzle header 3b are arranged in the middle positions of the respective nozzles 4a. Washing liquid 5a discharged from the nozzles 4a and washing liquid 5b discharged from the nozzles 4b are supplied to a same range in the substrate moving direction on the surface of the substrate 1. Nozzle headers 3c and 3d play the same role. COPYRIGHT: (C)2005,JPO&NCIPI
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