| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation in a semiconductor device wherein a lead frame mounting a semiconductor element is connected with a heat sink. SOLUTION: On a surface where a lead frame 2 at a heat sink 7 is connected, such a groove 7a as surround an area to which a connecting agent 4b is applied is formed. By constitution like this, while the connection of the heat sink 7 and the lead frame 2 is secured by an adhesive 4b charged into the groove 7a formed at the heat sink 7, the adhesive 4b is not interposed for direct contact with the lead frame 2 in an area of the heat sink 7 except for an area in which the groove 7a is formed, As a result, heat generated by a power chip 1a is efficiently radiated to the outside via the heat sink 7. COPYRIGHT: (C)2005,JPO&NCIPI |
