| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymerizable composition having reduced shrinkage at heat curing, utilizable in wide fields such as casting, filling, coating, adhering and molding, and especially usefully usable for an electric circuit or the like requiring heat resistance. SOLUTION: The cationically polymerizable composition comprises at least (A) 1-alkyl-4-hydroxymethyl-2,6,7-trioxabicyclo[2.2.2]octane represented by the chemical formula, and (B) a cationic polymerization initiator, and can be crosslinked and cured by heating. The condition of the crosslinking and curing is within a range of 100-300°C curing temperature. COPYRIGHT: (C)2005,JPO&NCIPI
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