| 摘要 |
A stacking photoresist image transferring method for fabricating a packaging substrate has two photoresist image transferring processes to define copper wires and I/O pad areas and Ni-Au electrolytic plating areas. The second photoresist image transferring process limits the Ni-Au electrolytic plating areas to be only on the I/O pads to decrease fabricating coat. In addition, solder resist can be directly formed on the copper wires to increase a connecting strength of the solder resist on the substrate. Thus, the method according to the present invention can fabricate high reliable packaging substrates.
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