发明名称 |
Method and apparatus for sub-micron device fabrication |
摘要 |
The present invention provides a method and apparatus for the preparation of sub-micron features for use in solid-state electronic applications. Creation of a template by logical design to produce features of predetermined size and shape allows for the use of a variety of deposition methods to be used to create the sub-micron features.
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申请公布号 |
US2004197939(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20030391506 |
申请日期 |
2003.03.18 |
申请人 |
CLARK COREY M. |
发明人 |
CLARK COREY M. |
分类号 |
C23C14/04;C23C16/04;H01L21/66;H01L21/68;(IPC1-7):H01L21/66 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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