发明名称 |
Method for thermally treating substrates |
摘要 |
To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
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申请公布号 |
US2004195229(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20030433253 |
申请日期 |
2003.07.17 |
申请人 |
SZEKERESCH JAKOB;DRESS PETER;DIETZE UWE;SAULE WERNER |
发明人 |
SZEKERESCH JAKOB;DRESS PETER;DIETZE UWE;SAULE WERNER |
分类号 |
H05B3/00;H01L21/00;H01L21/02;H01L21/027;(IPC1-7):F27B5/14;H05B1/02;F27D11/00 |
主分类号 |
H05B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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