发明名称 Method for thermally treating substrates
摘要 To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
申请公布号 US2004195229(A1) 申请公布日期 2004.10.07
申请号 US20030433253 申请日期 2003.07.17
申请人 SZEKERESCH JAKOB;DRESS PETER;DIETZE UWE;SAULE WERNER 发明人 SZEKERESCH JAKOB;DRESS PETER;DIETZE UWE;SAULE WERNER
分类号 H05B3/00;H01L21/00;H01L21/02;H01L21/027;(IPC1-7):F27B5/14;H05B1/02;F27D11/00 主分类号 H05B3/00
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