METHOD FOR MANUFACTURING ELECTRONIC COMPONENT-MOUNTED BOARD

摘要

A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step and a bonding step. In the temperature raising step, an electronic component (30A) having solder bump electrodes (31) containing a solder material is heated to a first temperature higher than the melting point of the solder material, and a wiring board (X') having electrode portions (21) corresponding to the solder bump electrodes (31) is heated to a second temperature lower than the first temperature. In the bonding step, the solder bump electrodes (31) and the electrode portions (21) are bonded by pressing the electronic component (30A) against the wiring board (X') while the solder bump electrodes (31) and the electrode portions (21) are being abutted.