| 摘要 |
<p>A ceramic printed circuit substrate includes a glass ceramic substrate (14a, 14b, 20a, 20b, 20c, 22) and a surface circuit pattern (14a, 14b, 20a, 20b, 20c, 22), which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide, and copper oxide. A ceramic green sheet (30) and a surface circuit pattern (32) formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000 DEG C, thereby yielding the ceramic printed circuit substrate. <IMAGE> <IMAGE></p> |
