| 摘要 |
PROBLEM TO BE SOLVED: To take out a semiconductor chip smoothly from a base substrate. SOLUTION: A process for manufacturing a semiconductor device comprises a step (a) for segmenting a semiconductor substrate 11 pasted by an adhesive 28 to a base substrate 26 provided with the adhesive 28 having a self-stripping property when energy 44 is applied, into a plurality of semiconductor chips 12, and a step (b) for applying the energy 44 to the adhesive 28. COPYRIGHT: (C)2005,JPO&NCIPI |
