发明名称 |
Wiring tape for semiconductor device including a buffer layer having interconnected foams |
摘要 |
In a semiconductor device having a three-layered buffer layer comprising core layer 1 having interconnected foams such as a three-dimensional reticular structure and adhesive layers 2 provided on both sides of the core layer as a stress buffer layer between semiconductor chip 5 and wiring 4 to lessen a thermal stress generated between the semiconductor device and the package substrate, where a thickness ratio of the core layer 1 to total buffer layer is at least 0.2, the production process can be simplified by using such a buffer layer, thereby improving the mass production capacity and enhancing the package reliability.
|
申请公布号 |
US2004195702(A1) |
申请公布日期 |
2004.10.07 |
申请号 |
US20040830051 |
申请日期 |
2004.04.23 |
申请人 |
OGINO MASAHIKO;EGUCHI SHUJI;NAGAI AKIRA;UENO TAKUMI;SEGAWA MASANORI;KOKAKU HIROYOSHI;ISHII TOSHIAKI;ANJOH ICHIRO;NISHIMURA ASAO;MIYAZAKI CHUICHI;MITA MAMORU;OKABE NORIO |
发明人 |
OGINO MASAHIKO;EGUCHI SHUJI;NAGAI AKIRA;UENO TAKUMI;SEGAWA MASANORI;KOKAKU HIROYOSHI;ISHII TOSHIAKI;ANJOH ICHIRO;NISHIMURA ASAO;MIYAZAKI CHUICHI;MITA MAMORU;OKABE NORIO |
分类号 |
H01L23/12;H01L23/31;H01L23/495;H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|