发明名称 |
FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a flat film carrier tape for mounting an electronic component which can improve reliability in carrying in a semiconductor mounting line or in mounting. SOLUTION: The film carrier tape 10 for mounting an electronic component has a wiring pattern 13 formed of a conductive layer 12 on the surface of an insulating layer 11 and a plurality of sprocket holes 14 provided to both sides of the wiring pattern 13. In the film carrier tape 10, an independent metallic layer 16 is formed for each sprocket hole 14 to enclose the sprocket hole 14. The metallic layer 16 is provided with a slit 17 which makes the metallic layer 16 discontinuous in at least one place over an outer circumference of the sprocket hole 14. Thereby, stress between the metallic layer 16 and the insulating layer 11 is released in moderation and a flat film carrier tape 10 for mounting an electronic component which can improve reliability of a semiconductor mounting line can be realized. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004281946(A) |
申请公布日期 |
2004.10.07 |
申请号 |
JP20030074568 |
申请日期 |
2003.03.18 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
OGAWA NAOAKI;SAKATA MASARU |
分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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主权项 |
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地址 |
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