| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board high in wiring density and low in cost. SOLUTION: The method for manufacturing a printed wiring board having metal posts formed on a semiconductor circuit comprises a step of forming a positive photosensitive resin layer on the conductor surface of a substrate having a conductor layer on its insulating layer, a first exposure and development step of removing the photosensitive resin layer from metal post forming locations, a step of filling the metal post forming locations with a metal, a second exposure and development step of removing the photosensitive resin layer from locations other than a conductor circuit forming region, a step of forming a conductor circuit region by etching, and a step of removing the photosensitive resin layer. By using this method, a printed wiring board high in wiring density is provided, and the numbers of manufacturing steps and manhours, and materials, are decreased. The costs for processing and materials are also decreased. COPYRIGHT: (C)2005,JPO&NCIPI
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