THIN-FILM INTEGRATED CIRCUIT DEVICE, IC LABEL, VESSEL INCLUDING THIN-FILM INTEGRATED CIRCUIT MOUNTED THEREON, MANUFACTURING METHOD THEREFOR, AND COMMODITY MANAGEMENT METHOD FOR COMMODITY INCLUDING VESSEL

摘要

PROBLEM TO BE SOLVED: To provide a thin-film integrated circuit having an extremely thin thickness; a thin-film integrated circuit device having the thin-film integrated circuit; a vessel for a commodity without spoiling the design thereof, particularly having a label (IC label) using the thin-film integrated circuit on the commodity demonstrated at a store; a manufacturing method for the integrated circuit, the integrated circuit device, the IC label and the vessel; and a management method of the commodity having the IC label mounted thereon.

SOLUTION: The thin-film integrated circuit includes a semiconductor film as an active region (for example, a channel forming region in the case of a thin-film transistor), differently from a conventional integrated circuit formed of a silicon wafer. Because of the extremely thin thickness of the thin-film integrated circuit, even when the integrated circuit is mounted on the commodity such as a card and a vessel, the vessel design is not spoiled.

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