发明名称 |
Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
摘要 |
<p>A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120 DEG C and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin such as silicone oil to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin. <IMAGE></p> |
申请公布号 |
EP1143512(A3) |
申请公布日期 |
2004.10.06 |
申请号 |
EP20010303105 |
申请日期 |
2001.03.30 |
申请人 |
THE BERGQUIST COMPANY |
发明人 |
MISRA, SANJAY;OLSON, RICHARD M. |
分类号 |
C08J3/20;C08K9/10;C08L83/04;C08L101/00;H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
C08J3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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