AIR CAVITY TYPE WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF TO MINIATURIZE SIZE OF AIR CAVITY TYPE WAFER LEVEL PACKAGE

摘要

PURPOSE: An air cavity type wafer level package and a fabricating method thereof are provided to miniaturize the size of the air cavity type wafer level package by forming a wafer level package having the same size as a chip. CONSTITUTION: A chip(310) has a peculiar characteristic. An internal electrode(320) is formed on an upper face of the chip in order to input and output an external signal. A structure(330) has the same size as the chip and includes an internal space. A via hole is formed around the internal space in order to be connected to the internal electrode. An air cavity is formed in the inside of the structure. A connection electrode(340) is formed by filling up conductive material into the connection path. An external electrode(350) is formed on an upper side of the structure in order to be connected to the connection electrode.