发明名称 |
PCB support plate method for PCB via fill |
摘要 |
Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
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申请公布号 |
US6800232(B2) |
申请公布日期 |
2004.10.05 |
申请号 |
US20020201416 |
申请日期 |
2002.07.22 |
申请人 |
TTM ADVANCED CIRCUITS, INC. |
发明人 |
LEWIS CHARLES W.;PEDIGO JESSE;SCHUG JOSEPH |
分类号 |
H05K3/12;H05K3/40;(IPC1-7):B29C65/56 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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