发明名称 Semiconductor device and fabrication method thereof
摘要 A semiconductor device includes a capacitor having a lower electrode (102), a high-dielectric-constant or ferroelectric thin film (103), and an upper electrode (104) which are subsequently stacked. An impurity having an action of suppressing the catalytic activity of a metal or a conductive oxide constituting the electrode is added to the upper electrode (104). The addition of the impurity is effective to prevent inconveniences such as a reduction in capacitance, an insulation failure, and the peeling of the electrode due to hydrogen heat-treatment performed after formation of the upper electrode (104), and to improve the long-term reliability.
申请公布号 US6800889(B2) 申请公布日期 2004.10.05
申请号 US20020073240 申请日期 2002.02.13
申请人 HITACHI, LTD. 发明人 TAKATANI SHINICHIRO;MIKI HIROSHI;KUSHIDA KEIKO;FUJISAKI YOSHIHISA;TORII KAZUYOSHI
分类号 H01L21/02;(IPC1-7):H01L29/76;H01L27/108;H01L21/824 主分类号 H01L21/02
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