Solid image pickup device

摘要

There is provided an extremely miniaturized solid image pickup apparatus having a bare-chip-on-bare-chip structure in which a bare chip of a solid image pickup device is directly mounted on an LSI bare chip including a driving circuit, and the bare chips are electrically connected to each other without via a printed wiring board. An active surface of the LSI bare chip is protected by providing a resin layer for absorbing a stress on the active layer of the LSI bare chip existing at a lower side.