| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device in which any nitrogen atmosphere need not be formed by adequately changing the characteristic of lead-free solder and removing dross. SOLUTION: The soldering device comprises a solder tank 1 having primary and secondary nozzles 2 and 3 to jet molten lead-free solder having a composition consisting of 98±0.5% Sn, 1.2±0.2% Ag, and 0.8±0.2% Cu, a carrying mechanism 11 to carry a circuit substrate 14 to be soldered with the lead-free solder jetted from the primary and secondary nozzles 2 and 3 in one side of the transverse direction above the solder tank 1, and a dross removing means 4 to allow the solder jetted from the primary and secondary nozzles 2 and 3 to flow into the solder tank 1 in the direction across the carrying direction of the circuit substrate 14. COPYRIGHT: (C)2004,JPO&NCIPI |
