| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which is used in a clean room and where the amount of release(volatilization) of an organic compound is controlled or reduced, an epoxy-based semiconductor sealing resin, a packaging circuit board, an insulation paper, a board processing equipment, and a vertical type heat treatment apparatus. SOLUTION: The circuit board is used in a clean room. This board is formed as follows: a glass fiber, which is treated with a silicone oil which is obtained by removing a cyclic siloxane having a number silicon not exceeding 10 by heated distillation under a reduced pressure, and then is made to contain a flame retardant epoxy resin material of a molecular weight of not smaller than 300 and a hardening agent; then, copper foils of a glass epoxy substrate, with the copper foils being positioned on its both sides, are etched with an etchant; then, a solder resist, whose main agent is epoxy acrylate and its curing agent is a benzophenone-based ultraviolet curing agent, is applied on the etched sides and is cured by ultraviolet. COPYRIGHT: (C)2004,JPO&NCIPI
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