| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on the ceramic substrate is arranged at a position pertinent to the recess of a groove for escaping adhesive formed on the aluminum plate. SOLUTION: An aluminum plate is formed with a groove so that a power element on a ceramic substrate can be positioned at the projecting part of the groove for escaping adhesive. Thus, it is possible to reduce a thermal resistance when the heat generation of the power element is transmitted to the aluminum plate playing the role of a heat sink, and to suppress the increase of the temperature of the power element. COPYRIGHT: (C)2004,JPO&NCIPI |
