PHENOL RESIN FOR MOLDING MATERIAL, AND PHENOL RESIN COMPOSITION FOR MOLDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a phenol resin for a molding material, exhibiting excellent heat resistance when used as a binder for a molding material; and to provide a phenol resin composition for the molding material obtained by compounding the phenol resin. SOLUTION: The phenol resin for the molding material has a repeating unit represented by general formula (I) in the molecule. The phenol resin composition for the molding material contains the phenol resin. The phenol resin for the molding material preferably has 300-15,000 weight average molecular weight and 60-140°C softening point. COPYRIGHT: (C)2004,JPO&NCIPI