发明名称 Computer housing with multiple layer cooling walls and heat conducting tubes for fanless cooling of the power supply and the processor
摘要 <p>A housing system for a computer has one or more integrated multi-layer cooling body walls (4). A fanless power supply is directly connected to one of the outer walls. The heat from the processor (12) is conducted to the cooling body walls by means of heat conduction tubes (18). The cooling body walls comprise a base plate of metal with very high heat conductivity, i.e. greater than aluminum and at least a layer of aluminum or an aluminum alloy with cooling fins.</p>
申请公布号 DE10311527(A1) 申请公布日期 2004.09.30
申请号 DE2003111527 申请日期 2003.03.17
申请人 RICHARD WOEHR GMBH 发明人 WOEHR, STEFAN;WOEHR, JUERGEN
分类号 G06F1/18;G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/18
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