| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method that can be applied to a wide range of electronic components, can reduce process expenses, and can secure high mounting reliability. SOLUTION: In mounting an electronic component with solder bumps on a substrate by soldering, a resin adhesive 3 prepared by mixing metallic powder 7 prepared by processing a precious metal, such as silver etc., having a higher melting point than solder into flakes and an activator which works to remove solder oxide films in a thermosetting resin 3a is supplied in advance to the circuit electrodes 2 of the substrate as an auxiliary material for soldering. When the electronic component is soldered to the substrate, the resin adhesive 3 is interposed between the solder bumps (6) and circuit electrodes 2. Consequently, the occurrence of defective soldering caused by gaps can be prevented even when gaps exist between the solder bumps (6) and circuit electrodes 2, because molten solder 6a can be led to and brought into contact with the circuit electrodes 2 through bridges formed of the metallic powder 7. COPYRIGHT: (C)2004,JPO&NCIPI |
