发明名称 |
Surface acoustic wave device and method of fabricating the same |
摘要 |
A method of fabricating a surface acoustic wave device includes the steps of: joining a supporting substrate to a second surface of a piezoelectric substrate opposite to a first surface thereof; grinding and polishing the first surface of the piezoelectric substrate; grinding and polishing a third surface of the supporting substrate opposite to another surface thereof to which the second surface of the piezoelectric substrate is joined; and forming, on the first surface of the piezoelectric substrate, an on-chip pattern including comb-like electrodes and electrode pads.
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申请公布号 |
US2004189146(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20040809867 |
申请日期 |
2004.03.26 |
申请人 |
FUJITSU MEDIA DEVICES LIMITED;FUJITSU LIMITED |
发明人 |
UEDA MASANORI;KAWACHI OSAMU;MIURA MICHIO;WARASHINA SUGURU |
分类号 |
H01L41/09;H01L41/18;H01L41/22;H03H3/08;H03H9/25;(IPC1-7):H02N2/00;H01L41/04;H01L41/08 |
主分类号 |
H01L41/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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