发明名称 Surface acoustic wave device and method of fabricating the same
摘要 A method of fabricating a surface acoustic wave device includes the steps of: joining a supporting substrate to a second surface of a piezoelectric substrate opposite to a first surface thereof; grinding and polishing the first surface of the piezoelectric substrate; grinding and polishing a third surface of the supporting substrate opposite to another surface thereof to which the second surface of the piezoelectric substrate is joined; and forming, on the first surface of the piezoelectric substrate, an on-chip pattern including comb-like electrodes and electrode pads.
申请公布号 US2004189146(A1) 申请公布日期 2004.09.30
申请号 US20040809867 申请日期 2004.03.26
申请人 FUJITSU MEDIA DEVICES LIMITED;FUJITSU LIMITED 发明人 UEDA MASANORI;KAWACHI OSAMU;MIURA MICHIO;WARASHINA SUGURU
分类号 H01L41/09;H01L41/18;H01L41/22;H03H3/08;H03H9/25;(IPC1-7):H02N2/00;H01L41/04;H01L41/08 主分类号 H01L41/09
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