SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device with a plurality of semiconductor chips internally connected capable of supressing the number of components and easily manufacturing.

SOLUTION: The integrated circuit of a first semiconductor chip 102 is formed in an upper direction on a page shown in Fig. And the integrated circuit of a second semiconductor chip 103 is formed in a lower direction on the page shown in Fig. The chip 102 and the chip 103 sandwich a non-conductive die pad 107. A connection part 110 projecting from the chip 102 and the chip 103 is provided to the pad 107. The part 110 has a metal plating on its surface and is electrically conductive. The integrated circuits of the chip 102 and the chip 103 are respectively connected to inter-chip connecting wires 104a and 104b through the part 110.

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