| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide resin which does not cause the oxidation of copper, is capable of being cured at low temperatures, and is excellent in patterning. <P>SOLUTION: The photosensitive resin composition comprises (A) a polyimide compound represented by the formula (wherein R<SP>1</SP>is a tetravalent organic group comprising an aromatic group; R<SP>2</SP>is a divalent organic group comprising an aliphatic group or an aromatic group, provided that 10 to 100 mol% of the entire R<SP>2</SP>groups are divalent organic groups having a spiroacetal structure; and n is an integer of 1 to 200). (B) a photosensitizer that generates an acid upon irradiation with an actinic radiation, (C) a polymerization inhibitor, and (D) a solvent. A method for forming a negative pattern by using the resin composition is also provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
