| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device the semiconductor chip of which has a long temperature cycle life and a simple structure. SOLUTION: This semiconductor device (10) is provided with: a semiconductor chip (11) provided with first and second main surfaces (15) and (17) facing each other, and first and second electrodes on the main surfaces (15) and (17) respectively; first and second conductive cases (12) and (13) which are positioned to face the main surfaces (15) and (17) of the semiconductor chip (11) respectively and to which the first and second electrodes are respectively connected through solder (16 and 18); and an insulator (14) positioned between the first and the second conductive cases (12) and (13). The conductive cases (12 and 13) and insulator (14) constitute a case covering the whole body of the semiconductor chip (11). COPYRIGHT: (C)2004,JPO&NCIPI |
