DEVICE AND METHOD FOR MEASURING ELECTRICAL PROPERTIES OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a device for measuring electric properties of a semiconductor wafer having an improved probe structure that enables minimizing the interferences or electric conduction from an area outside the target area to the target area or a probe, and also to provide a measuring device that enables reducing the time required for mapping and measuring processes and cost. SOLUTION: The device is adapted for measuring at least one electric property of a semiconductor wafer, and provided with a probe having a shaft with an electrically conductive tip at an end to create electrical conduction with the target area of a semiconductor wafer. The device is further provided with a device adapted for applying electric stimulus between the conductive tip and the target area, and a device adapted for measuring a response of the semiconductor wafer to the electric stimulus and deciding on the at least one electric property of the semiconductor wafer based on the response. A probe protector that surrounds the shaft of the probe is provided adjoining the end of the probe. The probe protector prevents electric conduction between the probe and the area outside the target area of the semiconductor wafer. COPYRIGHT: (C)2004,JPO&NCIPI