发明名称 |
Hot plate unit |
摘要 |
The purpose of the present invention is to provide a hot plate unit (10) capable of carrying out temperature-rising and temperature-falling sufficiently quickly even if the diameter of a substrate (11) becomes wide and with which apparatus can be downsized. The present invention provides a hot plate unit (10) comprising a supporting case (22) and a substrate (11) equipped with a temperature adjustment means; said substrate (11) being fitted to the supporting case (22), wherein the thickness of the supporting case (22) is 50 mm or less. <IMAGE> |
申请公布号 |
EP1463381(A1) |
申请公布日期 |
2004.09.29 |
申请号 |
EP20040013344 |
申请日期 |
2001.05.01 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
HIRAMATSU, YASUJI;YASUTAKA, ITO |
分类号 |
H01L21/00;H01L21/027;H05B1/02;H05B3/14;H05B3/16;H05B3/18;H05B3/28;H05B3/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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