发明名称 |
Packaging silicon on silicon multichip modules |
摘要 |
<p>The specification describes interconnection assemblies for silicon-on-silicon multichip modules. The silicon-on-silicon MCMs are mounted on epoxy/glass laminates which have a coefficient of thermal expansion (CTE) that essentially matches the CTE of silicon. In the preferred embodiment the assembly is a PC card with card edge connectors, i.e. without fixed solder interlevel interconnections, so that the CTE of the epoxy laminate comprising the card can be modified without regard to potential mismatch with a mother board. <IMAGE></p> |
申请公布号 |
EP0959500(A3) |
申请公布日期 |
2004.09.29 |
申请号 |
EP19990303632 |
申请日期 |
1999.05.10 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
DEGANI, YINON;DUDDERAR, THOMAS DIXON;TAI, KING LIEN |
分类号 |
H05K1/14;H01L25/04;H01L25/065;H01L25/18;(IPC1-7):H01L23/538;H01L25/00 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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