| 摘要 |
A construction for the housing of electronic equipment comprising a casing (1a), a plurality of electronic modules (9, 13, 17) in the casing, and a cooling arrangement for providing cooling of the electronic modules, wherein the cooling arrangement is adapted to provide cooling by air convection without the assistance of any fan, wherein a first one or more of the modules (13) is housed in a first enclosure (15) within the construction and a second one or more of the modules (9) is housed in a second enclosure (11) within the construction, the first and second enclosures being separated (7) to inhibit mixing of the air which cools the modules respectively in the first and second enclosures, wherein the modules extend vertically with vertically extending airflow gaps adjacent to the modules.
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